Description
On Module Features:
Zynq Ultrascale+ RFSoC |
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Memory |
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Board to Board Connector1 Interfaces (400pin):
ADC | 16 x ADC Channels up to 2.5Gsps |
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DAC | 16 x DAC Channels up to 10Gsps |
PL IOs | PL IOs – 188 IOs
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Board to Board Connector2 Interfaces (400pin):
From PL Block |
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From PS Block |
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Clock signals |
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General Features:
Power Input | 12V through B2B Connector2 |
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Form Factor | 90mm x 100mm(BRYN) |
BSP Support | Linux BSP:- Petalinux/vivado 2022.2 |
Operating Temperature | -40°C to +85°C (Industrial Grade) |
Environment Specification | REACH & RoHS3 Compliant |
Compliance | CE* |
RF DAC/ADC Specifications:
- 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz)
- 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
- 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz)
- 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz)
High Speed and Interface Specifications:
- PCIe Gen3 x8 Edge Connector.
- FMC+ High Pin count(HPC) connector
- 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
- NVMe PCIe Gen2 x2 M.2 Connector
- Gigabit Ethernet through RJ45MagJack
- Debug & DATA UART/JTAG through Type-C Connector
- Operating Temperature: -30°C to +85°C
- Form Factor : 254mm x 111.15mm (3/4 Length PCIe Card)
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