Description
On Module Feature:
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Two 240pin High Speed Board to Board Connectors Interfaces
From HPS Block | Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY) USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) SPI x 1 Debug UART x 1 I2C x 1 GPIOs x 14 |
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From FPGA Block | FPGA High Speed Transceivers (upto17.4Gbps) x 24
FPGA IOs
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General Features:
Power Input | 5V through B2B Connector |
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Operating Temperature | -40°C to +85°C |
Form Factor | 75mm x 95mm |
BSP Support | Linux BSP:- Linux 5.4/Quartus 21.3 |
Environment Specification | RoHS &REACH Compliant |
Compliance | CE* |
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