Description
Opis
Komputer modułowy standardu COM Express® Compact (Rev. 3.0) oparty na procesorach Intel® Atom X, Intel® Celeron® J / N oraz Intel® Pentium® N rodziny Apollo Lake.
SECO COM Express MIRANDA to prawdziwa potęga, z maksymalnie 8 GB pamięci DDR3L w dwóch gniazdach SO-DIMM. Dostępny również w przemysłowym zakresie temperatur, zapewnia wyjątkową wydajność grafiki na maksymalnie trzech niezależnych wyświetlaczach jednocześnie w rozdzielczości 4K. Jego możliwości dekodowania/kodowania sprzętowego obsługują kilka standardów kompresji wideo, w tym formaty HEVC (H.265), H.264, MVC, VP8, VP9 i JPEG/MPEG. Podsumowując, komputer w module jest szczególnie doskonałym połączeniem wysokiej klasy grafiki i konstrukcji o niskim poborze mocy, dzięki czemu idealnie nadaje się do zastosowań przemysłowych o niskim poborze mocy.
 Description |
The COM Express® MIRANDA is a real powerhouse, with up to 8GB DDR3L memory on two SO-DIMM slots. Also available in the industrial temperature range, it delivers outstanding graphics performance through up to three independent displays at the same time in 4K resolution. Its HW decoding/encoding capabilities support several video compression standards, including HEVC (H. 265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats. All in all, the computer-on-module is a particularly great combination of high-end graphics and low power design and, thereby, is the ideal match for low-power industrial applications. |
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 Cpu |
Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP |
| Max Cores |
4 |
| Memory |
Two DDR3L SO-DIMM Slots supporting DDR3L-1866 non-ECC Memory, up to 8GB |
 Graphics |
Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units Three Independent displays supported HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats |
 Video Interfaces |
Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4b eDP 1.3 or Single/Dual-Channel 18-/24- bit LVDS interface optional VGA interface |
 Video Resolution |
DP: Up to 4096 x 2160 @60HZ eDP: Up to 3840 x 2160 @60Hz HDMI: Up to 3840 x 2160 @30Hz LVDS, VGA: Up to 1920 x 1200 @ 60Hz |
 Mass Storage |
Optional eMMC 5.0 drive soldered on-board 2 x external S-ATA Gen3 Channels microSD Card Slot onboard |
 Networking |
Optional Gigabit Ethernet interface Intel® I210 or I211 GbE Controller (MAC + PHY) |
 Usb |
Up to 4 x USB 3.0 Host ports 8 x USB 2.0 Host port |
| Pci |
Up to 5 x PCI-e x 1 Gen2 lanes |
 Audio |
HD Audio Interface |
 Serial Ports |
2 x UARTs |
 Other Interfaces |
SPI, I2C, SM Bus, Thermal Management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4x GPI, 4 x GPO |
 Power Supply |
+12VDC ± 10% and + 5VSB (optional) |
 Operating System |
Microsoft® Windows 10 Enterprise (64-bit) Microsoft® Windows 10 IoT core Wind River Linux (64 bit) Yocto (64 bit) Android (planning) |
 Operating Temperature |
0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version)*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
 Dimensions |
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
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