Description
Opis
Nowe moduły COM-Express®, oparte na Intel® Core™ 13. generacji (poprzednia nazwa kodowa Raptor Lake-P), oferują znaczny wzrost wydajności w porównaniu z poprzednią generacją i są wyposażone w maksymalnie 14 rdzeni opartych na hybrydowej architekturze wydajności Intel®.
Moduły COM-Express® zapewniają podstawowe funkcje klasy przemysłowej, takie jak obsługa pamięci z kodem korekcji błędów w paśmie (IBECC), Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) i rozszerzone temp. zakres od -40C do +85C (praca).
Wszystkie funkcje są idealne do zastosowań w wymagających obszarach, takich jak automatyka przemysłowa, opieka zdrowotna i motoryzacja.
FEATURES
| Compliance | COM Express® Compact Pin-out Type 6 |
| Dimension (H x W) | 95 x 95 mm |
| CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
| Chipset | Integrated SoC |
| Main Memory | Dual-Channel LPDDR5 memory down up to 64 GByte |
| Graphics Controller | Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors |
| Ethernet Controller | Intel® I226IT |
| Ethernet | Up to 2.5Gb Ethernet with TSN support |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA) 2x 4 PCIe 4.0 on PEG Lanes #0-7 1x 8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU) |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | High Definition Audio interface |
| Common Features | (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows®10, Linux, VxWorks (project based) |
| Temperature | Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
VARIANTS
| COMe-cRP6 E2 i7-13800HRE 64GB 36037-6400-25-7 |
 |
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HRE, 6×2.5GHz, 64GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i7-13800HRE 32GB 36037-3200-25-7 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HRE, 6×2.5GHz, 32GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i5-13600HRE 32GB 36037-3200-27-5 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HRE, 4×2.7GHz, 32GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i5-13600HRE 16GB 36037-1600-27-5 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HRE, 4×2.7GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i3-13300HRE 16GB 36037-1600-21-3 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HRE, 4×2.1GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i7-1370PRE 32GB 36037-3200-19-7 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PRE, 6×1.9GHz, 32GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i5-1350PRE 16GB 36037-1600-18-5 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PRE, 4×1.8GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i3-1320PRE 16GB 36037-1600-17-3 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PRE, 4×1.7GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i7-1365URE 16GB 36037-1600-17-7 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i7-1365URE, 2×1.7GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i5-1345URE 16GB 36037-1600-14-5 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i5-1345URE, 2×1.4GHz, 16GB memory down, industrial temperature grade | |
| COMe-cRP6 E2 i3-1315URE 8GB 36037-8000-12-3 |
|
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Core™ i3-1315URE, 2×1.2GHz, 8GB memory down, industrial temperature grade |
ACCESSORIES
| COME EVAL CARRIER2 T6 38116-0000-00-5 |
|
COM Express® Evaluation Carrier Type 6 | |
| HSP COME-CAP6 CU-CORE THREADED 36035-0000-99-0 |
|
Heatspreader for COMe-cAP6, Cu-core, threaded mounting holes | |
| HSP COME-CAP6 CU-CORE THROUGH 36035-0000-99-1 |
|
Heatspreader for COMe-cAP6, Cu-core, through mounting holes | |
| COME ACTIVE UNI COOLER2 (W/O HSP) 36099-0000-99-4 |
|
COM Express® Universal Active Cooler for Heatspreader Mounting (95 x 95 x 14.3) – 90° turnable | |
| COME PASSIVE UNI COOLER2 (W/O HSP) 36099-0000-99-5 |
|
COM Express® Universal Passive Cooler for Heatspreader Mounting (95 x 95 x 14.3) – 90° turnable |
Zainteresowany tym produktem?
Serdecznie zapraszamy do kontaktu!
