Komputery i elektronika przemysłowa dla wymagających!

Serdecznie zapraszamy do kontaktu:

+48 797 383 766

info@me-embedded.eu

Zapytanie ofertowe

SECO CALLISTO

Komputer modułowy COM Express® Basic Type 6 oparty na procesorach Intel® Core™ 13 generacji Raptor Lake-P

SECO CALLISTO

Procesory Intel® Core™ 13 generacji Raptor Lake-P
1x NBase-T 2,5GbE; 2x USB4.0 Gen2; 4x USB 3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 i 2x PEG x4 Gen4
Wbudowana grafika Intel® Iris® Xe z maksymalnie 96 jednostkami wykonawczymi
Dwa gniazda DDR5 SO-DIMM obsługujące pamięć DDR5-4800 IBECC, do 64 GB
Dostępne w przemysłowym zakresie temperatury pracy

SKU: SECO CALLISTO

Opis

Description

Opis

SECO CALLISTO to komputer modułowy standardu COM Express® Basic (Rev. 3.1) w formacie Basic Type 6 oparty na procesorach Intel® Core™ 13 generacji Raptor Lake-P.

Karta katalogowa Manual

Description	COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
Cpu	13th Generation Intel® Processors (Raptor Lake-P) Intel® Core™ i7 13800HRE, 14 Core 6P+8E, 45W TDP Intel® Core™ i5 1250PRE, 12 Core 4P+8E, 28W TDP Intel® Core™ i3 1315URE, 6 Core 2P+4E, 15W TDP Intel® Core™ i7 13800HE, 14 Core 6P+8E, 45W TDP Intel® Core™ i5 1350PE, 12 Core 4P+8E, 28W TDP Intel® Core™ i3 1315UE, 6 Core 2P+4E, 15W TDP Intel® Processor U300E, 5 Core 1P+4E, 15W TDP
Memory	Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
Graphics	Integrated Gen12 UHD Graphics Intel® Core™ i7: Iris® Xe with 96 Execution Units Intel® Core™ i5: Iris® Xe with 80 Execution Units Intel® Core™ i3: Iris® Xe with 64 Execution Units Intel® Processor U300E: Iris® Xe with 48 Execution Units Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K
Video Interfaces	Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
Video Resolution	HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920×1200 @ 60Hz
Mass Storage	2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
Networking	1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
Usb	Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports
Pci	Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4
Audio	HD audio and Soundwire/i2S audio interfaces
Serial Ports	2x UARTs
Other Interfaces	SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO
Power Supply	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Operating System	Microsoft® Windows 10 Linux Ubuntu
Operating Temperature	0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)

Zainteresowany tym produktem?

Serdecznie zapraszamy do kontaktu!