Description
Opis
Nowe moduły COM-Express®, oparte na Intel® Core™ 13. generacji (poprzednia nazwa kodowa Raptor Lake-P), oferują znaczny wzrost wydajności w porównaniu z poprzednią generacją i są wyposażone w maksymalnie 14 rdzeni opartych na hybrydowej architekturze wydajności Intel®.
Moduły COM-Express® zapewniają podstawowe funkcje klasy przemysłowej, takie jak obsługa pamięci z kodem korekcji błędów w paśmie (IBECC), Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) i rozszerzone temp. zakres od -40C do +85C (praca).
Wszystkie funkcje są idealne do zastosowań w wymagających obszarach, takich jak automatyka przemysłowa, opieka zdrowotna i motoryzacja.
FEATURES
| Compliance | COM Express® Basic Pin-out Type 6 |
| Dimension (H x W) | 125 x 95 mm |
| CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
| Chipset | Integrated SoC |
| Main Memory | 2x DDR5 SO-DIMM with up to 32 GByte per channel (non-ECC) |
| Graphics Controller | Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors |
| Ethernet Controller | Intel® I226LM/I226IT |
| Ethernet | Up to 2.5Gb Ethernet with TSN support (depending on SKU) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA or alternatively 8x with additional PCIe Switch) 2×4 PCIe 4.0 on PEG Lanes #0-7 1×8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU) |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | High Definition Audio interface |
| Common Features | (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows®10, Linux, VxWorks (project based) |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
VARIANTS
| COMe-bRP6 i7-13800HE 38040-0000-25-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HE, 6×2.5GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 i5-13600HE 38040-0000-27-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HE, 4×2.7GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 i3-13300HE 38040-0000-21-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HE, 4×2.1GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 i7-1370PE 38040-0000-19-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PE, 6×1.9GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 i5-1350PE 38040-0000-18-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PE, 4×1.8GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 i3-1320PE 38040-0000-17-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PE, 4×1.7GHz, 2x DDR5 non-ECC SO-DIMM | ||
| COMe-bRP6 E2 i7-13800HRE 38041-0000-25-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-13800HRE, 6×2.5GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade | ||
| COMe-bRP6 E2 i5-13600HRE 38041-0000-27-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-13600HRE, 4×2.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade | ||
| COMe-bRP6 E2 i3-13300HRE 38041-0000-21-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-13300HRE, 4×2.1GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade | ||
| COMe-bRP6 E2 i7-1370PRE 38041-0000-19-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-1370PRE, 6×1.9GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade | ||
| COMe-bRP6 E2 i5-1350PRE 38041-0000-18-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-1350PRE, 4×1.8GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade | ||
| COMe-bRP6 E2 i3-1320PRE 38041-0000-17-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-1320PRE, 4×1.7GHz, 2x DDR5 non-ECC SO-DIMM, industrial temperature grade |
ACCESSORIES
| COME EVAL CARRIER2 T6 38116-0000-00-5 |
COM Express® Evaluation Carier Type 6 | ||
| HSP COME-BRP6 CU-CORE THREADED 38040-0000-99-0 |
Heatspreader for COM-bRP6, Cu-core, threaded mounting holes | ||
| HSP COME-BRP6 CU-CORE THROUGH 38040-0000-99-1 |
Heatspreader for COM-bRP6, Cu-core, through mounting holes | ||
| HSK COME-BASIC ACTIVE (W/O HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
| HSK COME-BASIC PASSIVE (W/O HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
| DDR5-4800 SODIMM 32GB_BRP6 97040-3248-BRP6 |
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
| DDR5-4800 SODIMM 16GB_BRP6 97040-1648-BRP6 |
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
| DDR5-4800 SODIMM 8GB_BRP6 97040-0848-BRP6 |
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
| DDR5-4800 SODIMM 32GB E2_BRP6 97041-3248-BRP6 |
DDR5-4800, 32GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
| DDR5-4800 SODIMM 16GB E2_BRP6 97041-1648-BRP6 |
DDR5-4800, 16GB, 262P, 2400MHz, PC5-4800 SODIMM | ||
| DDR5-4800 SODIMM 8GB E2_BRP6 97041-0848-BRP6 |
DDR5-4800, 8GB, 262P, 2400MHz, PC5-4800 SODIMM |
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