Description
Opis
Komputer modułowy Kontron COMe-bID7 (E2) ze skalowalnością od 4 do 10 rdzeni w małej obudowie i jednostkach SKU dla przemysłowego zakresu temperatur od -40°C do +85°, a także niezawodność 24×7 / 10 lat umożliwia solidne wdrożenia w ograniczonej przestrzeni w trudnych i ekstremalnych warunkach.
Komputer modułowy Kontron COMe-bID7 mieści do 4 gniazd SO-DIMM dla max. 128 GB pamięci. Jako nośnik pamięci dostępny jest opcjonalnie wbudowany lutowany dysk SSD NVMe o pojemności do 1 TB.
Komputer modułowy Kontron COMe-bID7 oferuje 16 linii PCIe Gen4 plus 16 linii PCIe Gen3 i 4 interfejsy 10GBASE-KR zapewniają idealną obsługę wymagań wysokiej przepustowości danych w wymagających strukturach we/wy i sieci.
Konstrukcja 10GBASE-KR zapewnia maksymalną elastyczność poprzez zdefiniowanie fizycznego interfejsu — KR dla łączności na płycie montażowej, miedzianego (RJ45) lub światłowodowego (SFP+) — na płycie głównej.
FEATURES
| Compliance | COM Express® basic, Pin-out Type 7 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz Intel® Xeon® D-1735R, 59W, 8 core, 2.2GHz Intel® Xeon® D-1718T, 46W, 4 core, 2.6GHz Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp. Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp. Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp. Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp. see complete list in COMe-bID7 datasheet |
| Chipset | Integrated in SoC |
| Main Memory | 2x DDR4 SODIMM for up to 64 GByte ECC / non ECC on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC |
| Graphics Controller | – |
| Ethernet Controller | Intel® I225LM/IT Intel® Quad 10GbE LAN integrated in SoC |
| Ethernet | 1x 1/2.5 Gb (1/2.5 GBASE-T) 4x 10Gb (10 GBASE-KR) |
| Storage | 2x SATA3, 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 16x PCIe Gen4 (1 x16, 2 x8, 4 x4) 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) |
| Display | – |
| USB | 4x USB 3.0 (4x USB 2.0) |
| Serial | 2x serial interface (RX/TX only) |
| Audio | – |
| Special Features | TPM 2.0, NVMe SSD, additional 3rd and 4th SODIMM socket |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI UEFI |
| Operating System | Linux, Windows 10 IoT Enterprise, Windows Server 2022 |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | COMe-bID7 xxxxx commercial grade COMe-bID7 E2 xxxxx industrial grade |
VARIANTS
| COMe-bID7 E2 D-1746TER 68009-0000-46-1 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1746TER, 67/56W, 10 core, 2.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature | ||
| COMe-bID7 E2 D-1747NTE 68009-0000-47-2 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1747NTE, 80W, 10 core, 2.5GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature | ||
| COMe-bID7 E2 D-1732TE 68009-0000-32-1 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1732TE, 52W, 8 core, 1.9GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature | ||
| COMe-bID7 E2 D-1715TER 68009-0000-15-1 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1715TER, 50W, 4 core, 2.4GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial temperature | ||
| COMe-bID7 D-1749NT 68008-0000-49-2 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®D-1749NT, 90W, 10 core, 3.0GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket | ||
| COMe-bID7 D-1735TR 68008-0000-35-1 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1735R, 59W, 8 core, 2.2GHz, 4x 10GBASE-KR, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket | ||
| COMe-bID7 D-1718T 68008-0000-18-1 |
COM Express® basic pin-out type 7 COM.0 R3.1 with Intel® D-1718T, 46W, 4 core, 2.6GHz, 4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket |
ACCESSORIES
| COMe Eval Carrier T7 Gen2 |  |
COM Express® Eval Carrier Type 7 | more |
| HSP COMe-bID7 (E2) THREAD 68009-0000-99-0 |
Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes | ||
| HSP COMe-bDV7 (E2) THROUGH 68009-0000-99-1 |
Heatspreader for COMe-bID7 commercial and E2, through holes | ||
| HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP | ||
| HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP | ||
| DDR4-3200 SODIMM 8GB ECC_BID7 97030-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
| DDR4-3200 SODIMM 16GB ECC_BID7 97030-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
| DDR4-3200 SODIMM 32GB ECC_BID7 97030-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
| DDR4-3200 SODIMM 8GB ECC E2_BID7 97031-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
| DDR4-3200 SODIMM 16GB ECC E2_BID7 97031-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
| DDR4-3200 SODIMM 32GB ECC E2_BID7 97031-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C |
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