Description
Opis
COMe-bCL6 (R E2S) oferuje zwiększoną gęstość wydajności wraz z doskonałą obsługą grafiki na znormalizowanym komputerze typu 6 z modułem w oparciu o podstawową obudowę COM Express.
Dzięki zastosowaniu spójnych złączy COM Express i implementacji funkcji, COMe-bCL6 jest łatwo wymienialny i oferuje klientom największą elastyczność, projektując go w swoich urządzeniach wbudowanych w oparciu o indywidualne płyty nośne.
W szczególności wprowadzenie sześciordzeniowego procesora, rozszerzenie pamięci do ewentualnych 128 GB, dodatkowy wbudowany dysk SSD NVMe oraz kontynuacja obsługi szybkiej pamięci Intel® Optane ™ w celu przyspieszenia systemu powinny być wyróżnikiem w stosunku do poprzednich aplikacji.
Typowe obszary zastosowań można znaleźć na rynkach, takich jak komunikacja, cyfrowe oznakowanie, profesjonalne gry i rozrywka, obrazowanie medyczne i nadzór oraz bezpieczeństwo, a także sterowanie zakładami przemysłowymi i liniami maszyn na poziomie hali produkcyjnej i sterowni.
Ponadto wytrzymałe moduły R E2S – które oferują funkcję szybkiego wyłączania, obsługę pamięci ECC i temperaturę klasy przemysłowej. zakres użytkowania – spełniają specjalne wymagania aplikacji dla rynku wojskowego / obronnego i transportowego.
FEATURES
Compliance | COM Express® basic, Pin-out Type 6 |
Dimensions (H x W x D) | 125 x 95 mm |
CPU | Intel® Xeon® 8th Gen E-2176M, 6x 2.7 GHz (4.4 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i7-8850H, 6x 2.6 GHz (4.3 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i5-8400H, 4x 2.5 GHz (4.2 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i3-8100H, 4x 3.0 GHz, GT2, 45/35 W Intel® Xeon® 9th Gen E-2276ME (6x 2.8 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2276ML (6x 2.0 GHz, GT2, 25W) Intel® Xeon® 9th Gen E-2254ME (4x 2.6 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2254ML (4x 1.7 GHz, GT2, 25W) Intel® Core™ 9th Gen i7-9850HE (6x 2.7 GHz, GT2, 45W/35W) Intel® Core™ 9th Gen i7-9850HL (6x 1.9 GHz, GT2, 25W) Intel® Core™ 9th Gen i3-9100HL (4x 1.6 GHz, GT2, 25W) Intel® Celeron® 9th Gen G4930E (2×2.4 GHz, GT2, 35W) Intel® Celeron® 9th Gen G4932E (2×1.9 GHz, GT2, 25W) |
Chipset | Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™) |
Main Memory | Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request) |
Graphics Controller | Intel® UHD Graphics P630 for Xeon® processor Intel® UHD Graphics 630 for Core™ processors Intel® UHD Graphics 610 for Celeron® processors |
Ethernet Controller | Intel® I219LM |
Ethernet | 10/100/1000 MBit Ethernet |
Hard Disk | 4x SATA 6Gb/s |
Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
USB | 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 |
Serial | 2x serial interface (RX/TX only |
Audio | Intel® High Definition Audio |
Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe |
BIOS | AMI Aptio V |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset, 3rd/4th DDR4 SO-DIMM socket, NVMe SSD |
Power Management | ACPI 6.0 |
Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants) |
Operating System | Windows® 10, Linux, VxWorks |
Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
VARIANTS
COMe-bCL6 E-2176M CM246 38034-0000-27-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2176M, 6×2.7GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
COMe-bCL6 i7-8850H QM370 38034-0000-26-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-8850H, 6×2.6GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 i5-8400H QM370 38034-0000-25-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-8400H, 4×2.5GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 i3-8100H QM370 38034-0000-30-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-8100H, 4×3.0GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 E-2276ME CM246 38034-0000-28-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2276ME, 6×2.8GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
COMe-bCL6 E-2276ML CM246 38034-0000-20-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2276ML, 6×2.0GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
COMe-bCL6 E-2254ME CM246 38034-0000-26-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2254ME, 4×2.6GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
COMe-bCL6 E-2254ML CM246 38034-0000-17-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2254ML, 4×1.7GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
COMe-bCL6 i7-9850HE QM370 38034-0000-27-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-9850HE, 6×2.7GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 i7-9850HL QM370 38034-0000-19-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-9850HL, 6×1.9GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 i3-9100HL QM370 38034-0000-16-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-9100HL, 4×1.6GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 G4930E QM370 38034-0000-24-2 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G4930E, 2×2.4GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6 G4932E QM370 38034-0000-19-2 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G4932E, 2×1.9GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
COMe-bCL6R E2S E-2176M CM246 38035-0000-27-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2176M, 6×2.7GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i7-8850H QM370 38035-0000-26-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-8850H, 6×2.6GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i5-8400H QM370 38035-0000-25-5 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-8400H, 4×2.5GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i3-8100H CM246 38035-0000-30-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-8100H, 4×3.0GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S E-2276ME CM246 38035-0000-28-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2276ME, 6×2.8GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S E-2276ML CM246 38035-0000-20-6 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2276ML, 6×2.0GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S E-2254ME CM246 38035-0000-26-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2254ME, 4×2.6GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S E-2254ML CM246 38035-0000-17-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E-2254ML, 4×1.7GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i7-9850HE QM370 38035-0000-27-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-9850HE, 6×2.7GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i7-9850HL QM370 38035-0000-19-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-9850HL, 6×1.9GHz, QM370 PCH, GT2, 2x DDR4 non-ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S i3-9100HL CM246 38035-0000-16-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-9100HL, 4×1.6GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S G4930E CM246 38035-0000-24-2 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G4930E, 2×2.4GHz, CM246 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
COMe-bCL6R E2S G4932E CM246 38035-0000-19-2 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G4932E, 2×1.9GHz, CM246 PCH, GT2, 2x DDR4 non-ECC SO-DIMM, Rapid Shutdown, industrial temperature grade |
Supported Modules | COMe-bCL6(R E2S) xx-xxxxx CM246/QM370 |
ACCESSORIES
COMe Ref.Carrier–i T6 TMI 38115-0000-00-0 |
COM Express® Reference Carrier Type 6 for industrial temperature | more | |
COMe Eval Carrier2 T6 38116-0000-00-5 |
COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more | |
HSP COMe-bSL6/bKL6/bCL6 Cu-core threaded 38030-0000-99-0 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core threaded mounting holes | ||
HSP COMe-bSL6/bKL6/bCL6 Cu-core through 38030-0000-99-1 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core through holes | ||
HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP | ||
DDR4-2666 SODIMM 32GB_COM 97017-3200-27-0 |
DDR4-2666, 32GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 16GB_COM 97017-1600-27-0 |
DDR4-2666, 16GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 8GB_COM 97017-8192-27-0 |
DDR4-2666, 8GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 4GB_COM 97017-4096-27-0 |
DDR4-2666, 4GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 32GB E2_COM 97017-3200-27-2 |
DDR4-2666, 32GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 16GB E2_COM 97017-1600-27-2 |
DDR4-2666, 16GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 8GB E2_COM 97017-8192-27-2 |
DDR4-2666, 8GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 4GB E2_COM 97017-4096-27-2 |
DDR4-2666, 4GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 32GB ECC_COM 97018-3200-27-0 |
DDR4-2666, 32GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 16GB ECC_COM 97018-1600-27-0 |
DDR4-2666, 16GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 8GB ECC_COM 97018-8192-27-0 |
DDR4-2666, 8GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 4GB ECC_COM 97018-4096-27-0 |
DDR4-2666, 4GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 32GB ECC E2_COM 97018-3200-27-2 |
DDR4-2666, 32GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 16GB ECC E2_COM 97018-1600-27-2 |
DDR4-2666, 16GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 8GB ECC E2_COM 97018-8192-27-2 |
DDR4-2666, 8GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
DDR4-2666 SODIMM 4GB ECC E2_COM 97018-4096-27-2 |
DDR4-2666, 4GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM |
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