Description
Opis
COMe-mAS10 (E2) obsługuje szeroką skalowalność nowej serii Intel Atom® x7000E/x7000RE, przeznaczonej do zastosowań IoT. Asortyment sięga od zoptymalizowanych pod względem kosztów rozwiązań 2-rdzeniowych po wysokowydajne rozwiązania 8-rdzeniowe.
COMe-mAS10 (E2) do rozwiązań systemowych oszczędzających miejsce, obsługuje do 16 gigabajtów pamięci LPDDR5-4800, cztery linie PCIe 3.0, dwa interfejsy USB 3.2 Gen2/2.0 i sześć interfejsów USB 2.0, dwa porty SATA, wbudowaną pamięć eMMC , jeden port Ethernet 1GBASE-T (alternatywnie 2,5GBASE-T) z TSN.
FEATURES
| Compliance | COM Express® mini, Pin-out Type 10 – COM.0 R3.1 |
| Dimension (H x W) | 84 mm x 55 mm |
| CPU | COMe-mAS10: x7000E-Series COMe-mAS10 E2: x7000RE-Series |
| Chipset | Integrated in SoC |
| Main Memory | Up to 32 GByte LPDDR5 4800 MT/s memory down (In-Band ECC) |
| Graphics Controller | SOC: Intel® HD Gfx Gen12: LVDS/eDP, 1x DP |
| Ethernet Controller | SOC + LAN PHY GPY115 (GPY215 on request) |
| Ethernet | 1GBit Ethernet (2.5GBit on request with GPY215) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | eMMC option – up to 256 GByte eMMC TLC |
| PCI Express | PCIe Gen 3.0 – PCIe lane configurations: 4 x1, 2 x1 + 1 x2, 2 x2 |
| Display | DDI: DP++, LVDS: Single Channel 18/24 bit or eDP |
| USB | 2x USB 3.2 Gen2 (incl. USB 2.0) + 6x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | Industrial grade temperature |
| Options | eMMC up to 256 GByte TLC, eDP instead of LVDS, General Purpose SPI instead of Boot SPI, Trusted Platform module TPM 2.0, de-populated LAN PHY, 2.5GBit LAN instead of 1Gbit |
| Power Management | ACPI 6.0 |
| Power Supply | 4.75 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows® 10 (later Windoes 11), Linux |
| Temperature | COMe-mAS10- commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating COMe-mAS10 E2 – industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | industrial temperature: COMe-mAS10 E2 (34017-xxxx-xx-x) on request commercial temperature: COMe-mAS10 (34016-xxxx-xx-x) |
VARIANTS
| COMe-mAS10 E2 x7211RE 4G/32G 34017-0432-R1-2 |
COM Express® mini pin-out type 10 with Intel® Atom® x7211RE, 6W, 2 core, 1.0GHz, 4GB LPDDR5 memory down, GPY115 LAN, 32GB eMMC TLC, industrial temperature | ||
| COMe-mAS10 E2 x7213RE 4G/32G 34017-0432-R2-2 |
COM Express® mini pin-out type 10 with Intel® Atom® x7213RE, 9W, 2 core, 2.0GHz, 4GB LPDDR5 memory down, GPY115 LAN, 32GB eMMC TLC, industrial temperature | ||
| COMe-mAS10 E2 x7433RE 4G/32G 34017-0432-R2-4 |
COM Express® mini pin-out type 10 with Intel® Atom® x7433RE, 9W, 4 core, 1.5GHz, 4GB LPDDR5 memory down, GPY115 LAN, 32GB eMMC TLC, industrial temperature | ||
| COMe-mAS10 E2 x7835RE 8G/32G 34017-0832-R2-8 |
COM Express® mini pin-out type 10 with Intel® Atom®x67835RE, 12W, 8 core, 1.3GHz, 8GB LPDDR5 memory down, GPY115 LAN, 32GB eMMC TLC, industrial temperature |
ACCESSORIES
| HSP COMe-mAS10 (E2) thread 34017-0000-99-0 |
Heatspreader for COMe-mAS10 commercial and E2, threaded mounting | ||
| HSP COMe-mAS10 (E2) through 34017-0000-99-1 |
Heatspreader for COMe-mAS10 commercial and E2, through mounting holes | ||
| HSP COMe-mAS10 (E2) slim thread 34017-0000-99-2 |
Heatspreader for COMe-mAS10 slim commercial and E2, threaded mounting | ||
| HSP COMe-mAS10 (E2) slim through 34017-0000-99-3 |
Heatspreader for COMe-mAS10 slim commercial and E2, through mounting holes |
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