Description
Opis
Moduł COM Express® COMe-bEP7 oparty na procesorach AMD EPYC™ serii 3000 rozszerza rodzinę produktów Kontron o serwerowe platformy COM. COMe-bEP7 to bezgłowa i ekonomiczna opcja dla aplikacji wymagających dużej mocy obliczeniowej, takich jak obrazowanie medyczne i serwery.
COMe-bEP7 to wysokowydajny moduł o skalowalnej wydajności do 16 rdzeni. Moduł obsługuje opcjonalne cztery gniazda SODIMM z pamięcią do 128 GB, a także cztery porty 10Gb Ethernet. COMe-bEP7 jest oferowany do zastosowań komercyjnych lub rozszerzonych zakresów temperatur.
FEATURES
| Compliance | COM Express® Basic, Pin-out Type 7 |
| Dimension (H x W) | 95 x 125 mm |
| CPU | Commercial Temperature: AMD E3101 4C/4T, 35W TDP, 2.1GHz (2.9GHz) AMD E3151 4C/8T, 45W TDP, 2.7GHz (2.9GHz) AMD E3201 8C/8T, 30W TDP, 1.5GHz (3.1GHz) AMD E3251 8C/16T, 55W TDP, 2.5GHz (3.1GHz) AMD E3351 12C/24T, 65-80W TDP, 1.9GHz (3.0GHz) AMD E3451 16C/32T, 85-100W TDP, 2.45GHz (3.0GHz)Industrial Temperature: AMD E3255 8C/16T, 30-55W TDP, 2.0/2.5GHz (3.1GHz) |
| Main Memory | SP4r2 (single-die): 2x DDR4 SODIMM for up to 64GB non-ECC/ECC memorySP4 (dual-die): 2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory 4x DDR4 SODIMM for up to 128GB on request |
| Ethernet Controller | Internet i210 |
| Ethernet | 4x 10GbE KR/SFI |
| Hard Disk | 2x SATA |
| PCI Express / PCI support | SP4r2 (single-die): 24x PCIe Gen 3.0SP4 (dual-die): 32s PCIe |
| USB | 4x USB 3.1, 4x USB 2.0 |
| Serial | 2x serial interface |
| Common Features | SPI Flash, LPC, SMB, Dual Staged Watchdog, RTC On request for SP4 (dual-die): NVMe Support |
| Power Management | OS ACPI PM support for Critical Shutdown |
| Power Supply | ATX, 8.5V- 20 V Wide Range Single Supply |
| Special Features | TPM |
| Humidity | 93% relative Humidity at 40°C, non-condensing |
| Temperature | Commercial Grade Version: 0°C to 60°C Industrial Grade Version: -40°C to 85°C |
| BIOS | AMI UEFI |
| Operating System | Linux x64 – Ubuntu Windows Server x64 2016 |
| Supported Modules | COMe-bEP7 xxxxx commercial grade COMe-bEP7 E2 xxxxx industrial grade |
VARIANTS
| COMe-bEP7 E3101 68010-0000-01-1 |
 |
COMe-bEP7 E3101 | |
| COMe-bEP7 E3151 68010-0000-51-1 |
|
COMe-bEP7 E3151 | |
| COMe-bEP7 E3201 68010-0000-01-2 |
|
COMe-bEP7 E3201 | |
| COMe-bEP7 E3251 68010-0000-51-2 |
|
COMe-bEP7 E3251 | |
| COMe-bEP7 E3351 68010-0000-51-3 |
|
COMe-bEP7 E3351 | |
| COMe-bEP7 E3451 68010-0000-51-4 |
|
COMe-bEP7 E3451 | |
| COMe-bEP7 E3451 with 4 SODIMM sockets 68010-0000-61-4 |
|
COMe-bEP7 E3451 with 4 SODIMM sockets |
ACCESSORIES
| COMe Mount Kit 5mm 1set 38017-0000-00-5 |
|
COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions | |
| COMe Mount Kit 5mm 100sets 38017-0100-00-5 |
|
COM Express® Mounting Kit 5mm 100 sets | |
| COMe Mount KIT 8mm 1set 38017-0000-00-0 |
|
COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions | |
| COMe Mount Kit 8mm 100sets 38017-0100-00-0 |
|
COM Express® Mounting Kit 8mm 100sets | |
| ADA-COMe-Height-dua 38019-0000-00-0 |
|
ADA-COMe-Height-dua | |
| KAB-HSP 200mm 96079-0000-00-0 |
|
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm | |
| COMe Eval Carrier T7 Gen2 |  |
COM Express® Eval Carrier Type 7 | more |
| COMe Eval Carrier T7 68300-0000-00-0 |
 |
COM Express® Eval Carrier Type 7 | more |
| HSP COMe-bEP7 THREADED 68010-0000-99-0 |
|
Heatspreader for COMe-bEP7, threaded mounting holes | |
| HSP COMe-bEP7 THROUGH 68010-0000-99-1 |
|
Heatspreader for COMe-bEP7, through mounting holes | |
| DDR4-2666 8 GB non-ECC 97020-0827-BEP7 |
|
Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 16 GB non-ECC 97020-1627-BEP7 |
|
Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 32 GB non-ECC 97020-3227-BEP7 |
|
Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 16 GB non-ECC 97021-1627-BEP7 |
|
Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: -40 °C – 85 °C |
|
| DDR4-2666 8 GB non-ECC 97021-0827-BEP7 |
|
Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: -40 °C – 85 °C |
|
| DDR4-2666 32 GB non-ECC 97021-3227-BEP7 |
|
Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: -40 °C – 85 °C |
|
| DDR4-2666 8 GB ECC 97030-0827-BEP7 |
|
Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 16 GB ECC 97030-1627-BEP7 |
|
Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 32 GB ECC 97030-3227-BEP7 |
|
Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: 0°C- 60 °C |
|
| DDR4-2666 8 GB ECC 97031-0827-BEP7 |
|
Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: -40 °C – 85 °C |
|
| DDR4-2666 16 GB ECC 97031-1627-BEP7 |
|
Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: -40 °C – 85 °C |
|
| DDR4-2666 32 GB ECC 97031-3227-BEP7 |
|
Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: -40 °C – 85 °C |
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